Substrate transfer device and substrate gripping determination method
US11923222B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 20, 2021 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Apr 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67766
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A substrate transfer device includes: a support part configured to support a substrate to be transferred and provided with a plurality of engagement portions which are engaged with an edge of the substrate on a first side of the substrate; a gripping part configured to move toward or away from the plurality of engagement portions and provided with a plurality of contact portions which come into contact with the edge of the substrate on a second side of the substrate when moving toward the plurality of engagement portions; a plurality of detection parts provided in the plurality of contact portions, respectively, and configured to detect distortion amounts of the plurality of contact portions; and a determination part configured to determine a gripping situation of the substrate based on detection results obtained by the plurality of detection parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.