Lead-frame assembly, semiconductor package and methods for improved adhesion
US11923275B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2021 |
| Grant date | Mar 5, 2024 |
| Priority date | — |
| Expiry date | Oct 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/85385
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead-frame assembly is disclosed, for a semiconductor die and comprising a die attach pad and a plurality of elongate leads spaced apart therefrom; wherein each elongate lead has a first proximal end portion, a second distal end portion and a middle portion therebetween; wherein the die attach pad and each of the plurality of elongate leads each comprise a coating-free portion, and a coated portion having a coating material thereon; wherein a part of a perimeter of the die attach pad proximal each lead is comprised in the coating-free portion, and wherein the proximal end portion of each elongate lead is comprised in the coating-free portion. Associated package assemblies and methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.