High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same
US11926695B2 · kind B2 · utility
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22Claims
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Key dates
| Filing date | Jun 11, 2020 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Feb 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8581
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1. E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2 Formula 1In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.