Method to form high capacitance thin film capacitors (TFCs) as embedded passives in organic substrate packages
US11929212B2 · kind B2 · utility
0Cited by
0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2019 |
| Grant date | Mar 12, 2024 |
| Priority date | — |
| Expiry date | Jan 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments disclosed herein include an electronic package and methods of forming an electronic package. In an embodiment, the electronic package comprises a package substrate, an organic layer over the package substrate, and a capacitor embedded in the organic layer. In an embodiment, the capacitor comprises, a first electrode, where the first electrode comprises a seam between a first conductive layer and a second conductive layer, a dielectric layer over the first electrode, and a second electrode over the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.