Sameer Paital
11Patents
1h-index
30Co-inventors
46Inventor score
Filing activity: Mar 12, 2018 → Mar 29, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11443885B2 | Thin film barrier seed metallization in magnetic-plugged through hole inductor | Electricity | 2 | Active |
| US11322444B2 | Lithographic cavity formation to enable EMIB bump pitch scaling | Electricity | 1 | Active |
| US11227849B2 | Electroless-catalyst doped-mold materials for integrated-circuit die packaging architectures | Electricity | 0 | Active |
| US11929330B2 | Lithographic cavity formation to enable EMIB bump pitch scaling | Electricity | 0 | Active |
| US12334443B2 | Lithographic cavity formation to enable EMIB bump pitch scaling | Electricity | 0 | Active |
| US12230430B2 | Substrate embedded magnetic core inductors and method of making | Electricity | 0 | Active |
| US11929212B2 | Method to form high capacitance thin film capacitors (TFCs) as embedded passives in organic substrate packages | Electricity | 0 | Active |
| US11348718B2 | Substrate embedded magnetic core inductors and method of making | Electricity | 0 | Active |
| US12354963B2 | Lithographic cavity formation to enable EMIB bump pitch scaling | Electricity | 0 | Active |
| US11923312B2 | Patternable die attach materials and processes for patterning | Electricity | 0 | Active |
| US11728265B2 | Selective deposition of embedded thin-film resistors for semiconductor packaging | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.