Transfer hand and substrate processing apparatus with conductive ring and tilting vacuum pad
US11935779B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
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Key dates
| Filing date | Oct 28, 2021 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Oct 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various example embodiments provide a transfer hand for transferring a substrate. The transfer hand for transferring the substrate comprises: a body; and a vacuum assembly installed in the body and providing decompression to the bottom surface of a substrate to support the substrate at the upper part of the body; wherein the vacuum assembly comprises: an vacuum pad with conductivity contacting the substrate; and a sealing member provided between the vacuum pad and the body, the sealing member electrically connected to the vacuum pad; wherein the sealing member is grounded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.