Plurality of dies electrically connected to a printed circuit board by a clip
US11935807B2 · kind B2 · utility
0Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2021 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | May 19, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes a multilayer substrate including atop layer, a bottom layer and an intermediate layer between the top layer and the bottom layer. The package also includes one or more semiconductor dies embedded in the intermediate layer and conductive connector means to provide a conductive connection from the one or more dies. The conductive connector means extend through the top layer to provide connection means for one or more devices mounted on or adjacent the top layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.