Patent · US Active

Underfill flow management in electronic assemblies

US11935861B2 · kind B2 · utility

0Cited by

0References

16Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Frederick Atadana · Chandler, US
Taylor Gaines · Chandler, US
Edvin Cetegen · Chandler, US
Wei Li · Shanghai, CN
Hsin-Yu Li · Lexington, US
Tony Dambrauskas · Mesa, US

Key dates

Filing date	Apr 29, 2020
Grant date	Mar 19, 2024
Priority date	—
Expiry date	Jul 19, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/35121
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed herein are structures and techniques for underfill flow management in electronic assemblies. For example, in some embodiments, an electronic assembly may include a first component, a second component, an underfill on the first component and at least partially between the first component and the second component, and a material at a surface of the first component, wherein the material is outside a footprint of the second component, and the underfill contacts the material with a contact angle greater than 50 degrees.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.