Hsin-Yu Li
8Patents
2h-index
30Co-inventors
51Inventor score
Filing activity: Aug 13, 1993 → Dec 28, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5438439A | Non-destructive readout mechanism for volume holograms using two wavelengths | Physics | 41 | Expired |
| US8469261B2 | System and method for product identification | Physics | 32 | Active |
| US9122677B2 | System and method for product identification | Physics | 2 | Active |
| US9431274B2 | Method for reducing underfill filler settling in integrated circuit packages | Electricity | 1 | Active |
| US12417958B2 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone | Electricity | 0 | Active |
| US11935861B2 | Underfill flow management in electronic assemblies | Electricity | 0 | Active |
| US12315777B2 | Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone | Electricity | 0 | Active |
| US12347743B2 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.