Magnetic flux mitigation in superconducting circuits
US11937518B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 20, 2022 |
| Grant date | Mar 19, 2024 |
| Priority date | — |
| Expiry date | Oct 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/01
Abstract
One example includes a superconducting circuit. The circuit superconducting circuitry fabricated on a first surface of a circuit layer. The circuit layer includes a dielectric material. The circuit also includes a metal layer formed on a second surface of the circuit layer opposite the first surface and a through-substrate via (TSV) conductively coupled to the metal layer and extending through the circuit layer to the first surface. The circuit further includes a flux gasket conductively coupled to and extending from the TSV on the first surface proximal to the superconducting circuitry. The flux gasket can be configured to divert magnetic fields away from the superconducting circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.