Inventor · Silver Spring, MD, US

Daniel R. Queen

9Patents

3h-index

12Co-inventors

46Inventor score

Filing activity: Nov 12, 2014 → May 20, 2022

Most-cited inventions

Patent	Title	Area	Cited by	Status
US10229864B1	Cryogenic integrated circuit having a heat sink coupled to separate ground planes through differently sized thermal vias	Electricity	6	Active
US10727162B2	Integrated circuit having a heat sink coupled to separate ground planes through vias with different thermal characteristics	Electricity	4	Active
US10629535B2	Thermally isolated ground planes with a superconducting electrical coupler	Electricity	4	Active
US9741921B2	Hydrogen free amorphous silicon as insulating dielectric material for superconducting quantum bits	Chemistry; Metallurgy	2	Active
US9577174B2	CVD nanocrystalline silicon thermoelectric material	Electricity	2	Active
US9472745B2	CVD nanocrystalline silicon as thermoelectric material	Electricity	2	Active
US9530535B2	Hydrogen-free amorphous dielectric insulating thin films with no tunneling states	Chemistry; Metallurgy	2	Active
US12322524B2	Flux-trapping magnetic films in superconducting circuits	Electricity	0	Active
US11937518B2	Magnetic flux mitigation in superconducting circuits	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.