Patent · US Active

Module for chemically processing a substrate

US11938522B2 · kind B2 · utility

0Cited by
2References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 1, 2020
Grant dateMar 26, 2024
Priority date
Expiry dateDec 1, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/67086
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

The invention relates to a module for chemically processing a substrate, a method for chemically processing a substrate and a use of a module for chemically processing a substrate and in particular a large substrate. The module for chemically processing a substrate comprises: an immersion chamber, a spray unit, and a motion unit (14). The immersion chamber is configured to receive a first liquid and the substrate, so that the substrate is immersed in the liquid. The spray unit comprises a plurality of spray nozzles, which are configured to spray a second liquid within the immersion chamber. The motion unit is configured to provide a relative motion between the substrate and the spray unit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.