Module for chemically processing a substrate
US11938522B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2020 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Dec 1, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67086
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The invention relates to a module for chemically processing a substrate, a method for chemically processing a substrate and a use of a module for chemically processing a substrate and in particular a large substrate. The module for chemically processing a substrate comprises: an immersion chamber, a spray unit, and a motion unit (14). The immersion chamber is configured to receive a first liquid and the substrate, so that the substrate is immersed in the liquid. The spray unit comprises a plurality of spray nozzles, which are configured to spray a second liquid within the immersion chamber. The motion unit is configured to provide a relative motion between the substrate and the spray unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.