Substrate processing apparatus and substrate processing method
US11938524B2 · kind B2 · utility
0Cited by
0References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2020 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Feb 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67757
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes a liquid processing tank, and a hydrophobizing gas supply unit. The liquid processing tank stores a processing liquid and dips a plurality of substrates in the processing liquid to liquid-process the plurality of substrates. The hydrophobizing gas supply unit supplies a gas of a hydrophobizing agent to the plurality of substrates after liquid processing thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.