Silver sintering preparation and the use thereof for the connecting of electronic components
US11938543B2 · kind B2 · utility
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3References
18Claims
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Key dates
| Filing date | Apr 9, 2021 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Dec 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8384
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A silver sintering preparation in the form of a silver sintering paste comprising 70 to 95 wt.-% of coated silver particles (A) and 5 to 30 wt.-% of organic solvent (B) or in the form of a silver sintering preform comprising 74.5 to 100 wt.-% of coated silver particles (A) and 0 to 0.5 wt.-% of organic solvent (B), wherein the coating of the coated silver particles (A) comprises silver acetylacetonate (silver 2,4-pentanedionate) and/or at least one silver salt of the formula CnH2n+1COOAg with n being an integer in the range of 7 to 10, and wherein the at least one silver salt is thermally decomposable at >160° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.