Chemical mechanical planarization pads with constant groove volume
US11938584B2 · kind B2 · utility
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4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2020 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | May 19, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L75/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing pad includes a surface portion of a first material. The surface portion includes a plurality of grooves. A first portion of the grooves are exposed grooves located at a surface of the chemical mechanical polishing pad. A second portion of the grooves are buried grooves embedded below the surface of the chemical mechanical polishing pad, such that, during use of the chemical mechanical polishing pad, one or more of the buried grooves are exposed at the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.