Inspection method for detecting a defective bonding interface in a sample substrate, and measurement system implementing the method
US11942379B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2023 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Jul 26, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/95615
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A measurement system and an inspection method for detecting a defective bonding interface in a sample substrate including at least one element disposed on a support. The method comprises: placing the sample substrate in the measurement system, establishing an inclination map of the exposed surface, analyzing the inclination map and identifying a zone or zones of the exposed surface whose inclinations deviate by more than a given threshold from the inclination of the reference surface; and detecting the presence of a defective bond between the element and the support, depending on the result of the analysis of the inclination map.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.