Epitaxial layers with discontinued aluminium content for III-nitride semiconductor
US11942521B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 30, 2020 |
| Grant date | Mar 26, 2024 |
| Priority date | — |
| Expiry date | Jul 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a semiconductor device, comprising: a substrate (10); a stack of III-nitride transition layers (11) disposed on the substrate (10), the stack of III-nitride transition layers (11) maintaining an epitaxial relationship to the substrate (10); a first III-nitride layer (121) disposed on the stack of III-nitride transition layers (11); and a second III-nitride layer (122) disposed on the first III-nitride layer (121), the second III-nitride layer (122) having a band gap energy greater than that of the first III-nitride layer (121), wherein the stack of III-nitride transition layers (11) comprises a first transition layer (111), a second transition layer (112) on the first transition layer (111), and a third transition layer (113) on the second transition layer (112), and wherein the second transition layer (112) has a minimum aluminium molar ratio among the first transition layer (111), the second transition layer (112) and third transition layer (113). The present invention also relates to a method of forming such semiconductor device. The semiconductor device according to the present invention advantageously has a dislocation density less than or equal …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.