Methods and devices related to radio frequency devices
US11948802B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Dec 22, 2021 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Dec 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes a thinned semiconductor substrate having a first side and a second side opposite to the first side; and at least one radio frequency device at the first side, wherein the second side of the thinned semiconductor substrate is processed to reduce leakage currents or to improve a radio frequency linearity of the at least one radio frequency device through Bosch etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.