Hybrid package apparatus and method of fabricating
US11948877B2 · kind B2 · utility
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24Claims
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Key dates
| Filing date | Mar 24, 2021 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Aug 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some features pertain to a hybrid package that includes a die, a first substrate structure, and a first metallization structure that is at least partially coplanar with the substrate. The die is electrically coupled to the first metallization structure and the first substrate through a second metallization structure. The first metallization structure is configured to provide an electrical path for data signaling. The second metallization structure is configured as a ground plane and is coupled to a ground signal. The first substrate structure is configured to provide an electrical path for power signaling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.