Semiconductor device
US11948999B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2022 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Jul 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/834
Abstract
A device includes a first semiconductor fin, a second semiconductor fin, a source/drain epitaxial structure, a semiconductive cap, and a contact. The first semiconductor fin and the second semiconductor fin are over a substrate. The source/drain epitaxial structure is connected to the first semiconductor fin and the second semiconductor fin. The source/drain epitaxial structure includes a first protruding portion and a second protruding portion aligned with the first semiconductor fin and the second semiconductor fin, respectively. The semiconductive cap is on and in contact with the first protruding portion and the second protruding portion. A top surface of the semiconductive cap is lower than a top surface of the first protruding portion of the source/drain epitaxial structure. The contact is electrically connected to the source/drain epitaxial structure and covers the semiconductive cap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.