Shaping system including an evaporation cover, shaping process, and method of manufacturing an article
US11951660B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2021 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Oct 11, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/3433
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A shaping system comprises a dispensing station configured to dispense formable material on a substrate, a shaping station configured to contact the dispensed formable material on the substrate with a plate, a positioning system configured to move the substrate having the dispensed formable material from the dispensing system to the shaping station, and a cover having one or more walls. While the substrate having the dispensed formable material is moved by the positioning system from the dispensing station to the shaping station, the cover is positioned to enclose the substrate and the dispensed formable material such that a ratio of a diameter of the substrate to a distance between the cover and the substrate to 80:1 to 30:1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.