Methods and structures for changing wafer bow
US11955344B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2022 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Jan 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B43/27
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to an aspect of the disclosure, a method of controlling bow of a substrate is provided. In the method, a substrate is provided on which a dielectric layer is formed. The substrate has a bow with respect to a reference plane. The bow of the substrate is adjusted by performing an annealing process on the substrate. The annealing process includes one of a first process condition and a second process condition. The first process condition induces a tensile stress on the substrate to cause the substrate to bow upward with respect to the reference plane. The second process condition induces a compressive stress on the substrate to cause the substrate to bow downward with respect to the reference plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.