Composite structure, intended for a planar co-integration of electronic components of different functions
US11955375B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2022 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Jul 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83896
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composite structure, intended for a planar co-integration of electronic components of different functions, the composite structure including from its base towards its surface: a support substrate made of a first material, the support substrate including cavities each opening into an upper face of the support substrate, the cavities being filled with at least one composite material consisting of a matrix of a crosslinked preceramic polymer, the matrix being charged with inorganic particles; and a thin film made of a second material, the thin film being bonded to the upper face of the support substrate and to the composite material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.