Structures for bonding elements including conductive interface features
US11955393B2 · kind B2 · utility
3Cited by
154References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2021 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Sep 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10157
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonded structure is disclosed. The bonded structure includes a first element and a second element that is bonded to the first element along a bonding interface. The bonding interface has an elongate conductive interface feature and a nonconductive interface feature. The bonded structure also includes an integrated device that is coupled to or formed with the first element or the second element. The elongate conductive interface feature has a recess through a portion of a thickness of the elongate conductive interface feature. A portion of the nonconductive interface feature is disposed in the recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.