Electronic package and heat dissipation structure thereof, comprising bonding pillars
US11955404B2 · kind B2 · utility
0Cited by
1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2021 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Aug 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package includes an electronic component and a heat dissipation structure, wherein the heat dissipation structure has a plurality of bonding pillars, and a metal layer is formed on the bonding pillars, so as to stably dispose the heat dissipation structure on the electronic component via the bonding pillars and the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.