Jian-Dih Jeng
7Patents
4h-index
4Co-inventors
50Inventor score
Filing activity: Apr 29, 1992 → Dec 14, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5243493A | Fanless convection cooling design for personal computers | Physics | 50 | Expired |
| US5783860A | Heat sink bonded to a die paddle having at least one aperture | Electricity | 22 | Expired |
| US5789270A | Method for assembling a heat sink to a die paddle | Electricity | 7 | Expired |
| US5672547A | Method for bonding a heat sink to a die paddle | Electricity | 6 | Expired |
| US5356216A | Apparatus for measuring heat of circuit module | Physics | 3 | Expired |
| US11955404B2 | Electronic package and heat dissipation structure thereof, comprising bonding pillars | Electricity | 0 | Active |
| US10981787B2 | Oxygen generator | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.