Temperature control element utilized in device die packages
US11955406B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2022 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Jul 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may assist temperature control of the IC die when in operation. In one example, the temperature control element may have a plurality of thermal dissipating features disposed on a first surface of the IC die to efficiently control and dissipate the thermal energy from the IC die when in operation. A second surface opposite to the first surface of the IC die may include a plurality of devices, such as semiconductors transistors, devices, electrical components, circuits, or the like, that may generate thermal energy when in operation. The temperature control element may provide an IC die with high efficiency of heat dissipation that is suitable for 3D IC package structures and requirements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.