Metal pads over TSV
US11955445B2 · kind B2 · utility
2Cited by
222References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2022 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Jun 9, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Representative techniques and devices including process steps may be employed to mitigate the potential for delamination of bonded microelectronic substrates due to metal expansion at a bonding interface. For example, a metal pad having a larger diameter or surface area (e.g., oversized for the application) may be used when a contact pad is positioned over a TSV in one or both substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.