Patent · US Active

Apparatus and method for wafer cleaning

US11958090B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Bo Chen Chen · Hsinchu, TW
Sheng-Wei Wu · Dashulong, TW
Yung-Li Tsai · Houlong, TW

Key dates

Filing date	Jul 28, 2022
Grant date	Apr 16, 2024
Priority date	—
Expiry date	Jul 28, 2042

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB08B1/32
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.