Patent · US Active

Method for producing a connection between component parts, and component made of component parts

US11961820B2 · kind B2 · utility

0Cited by

27References

15Claims

0Family size

Assignee

Osram OLED GMBH · DE

Inventors

Simeon Katz · Regensburg, DE
Mathias Wendt · Eschborn, DE
Sophia Huppmann · Geldersheim, DE
Marcus Zenger · Abensberg, DE
Jens Mueller · Stuttgart, DE

Key dates

Filing date	Feb 5, 2019
Grant date	Apr 16, 2024
Priority date	—
Expiry date	Mar 2, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0364
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing a connection between component parts and a component made of component parts are disclosed. In an embodiment, a includes providing a first component part having a first exposed insulation layer and a second component part having a second exposed insulation layer, wherein each of the insulation layers has at least one opening, joining together the first and second component parts such that the opening of the first insulation layer and the opening of the second insulation layer overlap in top view, wherein an Au layer and a Sn layer are arranged one above the other in at least one of the openings and melting the Au layer and the Sn layer to form an AuSn alloy, wherein the AuSn alloy forms a through-via after cooling electrically conductively connecting the first component part to the second component part.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.