Laser dicing system for filamenting and singulating optical devices
US11964343B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Feb 24, 2021 |
| Grant date | Apr 23, 2024 |
| Priority date | — |
| Expiry date | Dec 15, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process of producing optical devices is provided including transferring a first substrate comprising one or more devices to a laser dicing tool, the laser dicing tool including a filamentation stage and a singulation stage. One or more device contours are created on the first substrate in the filamentation stage. The optical devices are singulated from the first substrate along the one or more device contours in the singulation stage. The devices are transferred to storage or for further backend processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.