Thickness measurement method, thickness measurement device, defect detection method, and defect detection device
US11965735B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2021 |
| Grant date | Apr 23, 2024 |
| Priority date | — |
| Expiry date | Feb 23, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K3/06
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thickness measurement method includes: heating a surface of the measurement object in a dot shape by a heating device; generating a thermal image corresponding to a temperature of the surface of the measurement object by capturing an image of the heated surface of the measurement object at a predetermined time interval by an imaging device; acquiring temperature data indicating temporal changes in temperature at multiple positions on the surface of the measurement object based on the thermal image generated by the imaging device; fitting a solution function indicating a solution of a heat conduction equation corresponding to a point heat source and including a parameter related to the thickness of the measurement object to the temperature data; and calculating the thickness of the measurement object based on a value of the parameter in the fitted solution function.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.