Resin composition, prepreg for printed circuit and metal-coated laminate
US11970591B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Dec 25, 2018 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Nov 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/029
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.