Composition, its use and a process for selectively etching silicon-germanium material
US11970647B2 · kind B2 · utility
0Cited by
4References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 19, 2020 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Aug 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32134
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described herein is a composition for selectively etching a layer including a silicon germanium alloy (SiGe) in the presence of a silicon-containing layer, particularly a layer comprising a-Si, SiOx, SiON, SiN, or a combination thereof, the composition including:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.