Vaporizer, substrate processing apparatus and method for manufacturing semiconductor device
US11970771B2 · kind B2 · utility
0Cited by
12References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2022 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Jul 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67098
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A vaporization system includes a vaporization chamber having a first portion and a second portion. A first fluid supply part is connected to the first portion of the vaporization chamber, and configured to supply a mixed fluid in which a first carrier gas and a liquid precursor are mixed, toward the second portion. A second fluid supply part is configured to supply a second carrier gas toward the mixed fluid at the second portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.