Method for determining patterning device pattern based on manufacturability
US11972194B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2022 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Dec 28, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/18
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for determining a patterning device pattern. The method includes obtaining (i) an initial patterning device pattern having at least one feature, and (ii) a desired feature size of the at least one feature, obtaining, based on a patterning process model, the initial patterning device pattern and a target pattern for a substrate, a difference value between a predicted pattern of the substrate image by the initial patterning device and the target pattern for the substrate, determining a penalty value related the manufacturability of the at least one feature, wherein the penalty value varies as a function of the size of the at least one feature, and determining the patterning device pattern based on the initial patterning device pattern and the desired feature size such that a sum of the difference value and the penalty value is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.