Lid attach process and dispenser head
US11972956B2 · kind B2 · utility
0Cited by
4References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2020 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Oct 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lid attach process includes dipping a periphery of a lid in a dipping tank of adhesive material such that the adhesive material attaches to the periphery of the lid. The lid attach process further includes positioning the lid over a die attached to a substrate using a lid carrier, wherein the periphery of the lid is aligned with a periphery of the lid carrier. The lid attach process further includes attaching the lid to the substrate with the adhesive material forming an interface with the substrate. The lid attach process further includes contacting a thermal interface material (TIM) on the die with the lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.