Unlanded thermal dissipation pillar adjacent active contact
US11972999B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2021 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Jan 19, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8503
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure includes an electrical device, and an active contact landed on a portion of the electrical device. The active contact includes a first body of a first material. A thermal dissipation pillar is adjacent the active contact and unlanded on but over the portion of the electrical device. The thermal dissipation pillar includes a second body of a second material having a higher thermal conductivity than the first material. The thermal dissipation pillar may be in thermal communication with a wire in a dielectric layer over the active contact and the thermal dissipation pillar. The electrical device can be any integrated circuit device that generates heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.