Laser processing apparatus, laser processing method, and correction data generation method
US11975403B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2020 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Sep 21, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/21
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser processing apparatus includes movable mirror for changing paths of laser light for processing and measurement light, and stage for changing an incident angle of measuring light. Furthermore, laser processing apparatus includes lens for condensing laser light for processing and measurement light on processing point, controller for controlling laser oscillator, movable mirror, and stage based on corrected data for processing, and measurement processor for measuring a depth of keyhole generated at processing point. The corrected data for processing is data corrected so as to a deviation of an arrival position of at least one of laser light for processing and measurement light caused by chromatic aberration of lens on the surface of workpiece. With this configuration, an accurate depth of keyhole can be measured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.