Semiconductor package comprising optically coupled IC chips
US11977256B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2022 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | May 23, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12142
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Various embodiments of the present disclosure are directed towards a semiconductor package comprising optically coupled integrated circuit (IC) chips. A first IC chip and a second IC chip overlie a substrate at a center of the substrate. A photonic chip overlies the first and second IC chips and is electrically coupled to the second IC chip. A laser device chip overlies the substrate, adjacent to the photonic chip and the second IC chip, at a periphery of the substrate. The photonic chip is configured to modulate a laser beam from the laser device chip in accordance with an electrical signal from the second IC chip and to provide the modulated laser beam to the first IC chip. This facilitates optical communication between the first IC chip to the second IC chip. Various embodiments of the present disclosure are further directed towards simultaneously aligning and bonding constituents of the semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.