Chip protective film and method for manufacturing same, and chip
US11978686B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2023 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Aug 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/544
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are a chip protective film, a method for manufacturing the same, and a chip, which relate to the technical field of electronic chip protective films. The chip protective film includes: a first protective layer, and a second protective layer attached to at least a portion of a surface of the first protective layer. The second protective layer includes by mass: 90%-97% acrylate compounds; 0.1-5% fluorine-containing compounds; and a second adjuvant. The chip protective film features strong adhesion, low friction coefficient, high hardness, and good scratch resistance, which effectively solves the technical problem in the prior art that chip protective films are not scratch resistant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.