De Wu
18Patents
3h-index
13Co-inventors
57Inventor score
Filing activity: Nov 29, 2000 → Oct 30, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6441436B1 | SOI device and method of fabrication | Electricity | 148 | Expired |
| US6326261A | Method of fabricating a deep trench capacitor | Electricity | 50 | Expired |
| US6271088A | Method for fabricating a buried vertical split gate memory device with high coupling ratio | Electricity | 11 | Expired |
| US6432827B1 | ILD planarization method | Electricity | 3 | Expired |
| US6368964B1 | Method for reducing resistance in a conductor | Electricity | 1 | Expired |
| US6466474B1 | Memory module having a two-transistor memory cell | Physics | 1 | Expired |
| US11767450B2 | Adhesive, die attach film and preparation method therefor | Chemistry; Metallurgy | 0 | Active |
| US12209171B2 | Liquid epoxy molding compound and preparation method thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US12098230B2 | Build-up film with low dielectric loss, preparation method therefor and circuit substrate structure | Electricity | 0 | Active |
| US12024591B2 | Modification method of polyphenylene ether resin, laminated film composite, laminated film, and substrate | Electricity | 0 | Active |
| US12252613B1 | Packaging film and preparation method thereof, and filter chip packaging method | Chemistry; Metallurgy | 0 | Active |
| US12255175B1 | Wafer warpage regulation epoxy functional film, and preparation method and application thereof | Electricity | 0 | Active |
| US11978686B2 | Chip protective film and method for manufacturing same, and chip | Electricity | 0 | Active |
| US11804463B2 | Underfill for chip packaging and chip packaging structure | Electricity | 0 | Active |
| US11643499B2 | Liquid molding compound for protecting five edges of semiconductor chip and preparation method thereof | Chemistry; Metallurgy | 0 | Active |
| US12037488B1 | Liquid molding compound and preparation method thereof | Chemistry; Metallurgy | 0 | Active |
| US11879076B1 | Composition, adhesive film and chip packaging structure | Electricity | 0 | Active |
| US11286386B1 | Circuit build-up film for wafer-level packaging, and fabrication method and use thereof | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.