Patent · US Active

Semiconductor device package comprising side walls connected with contact pads of a semiconductor die

US11978693B2 · kind B2 · utility

1Cited by

4References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Petteri Palm · Regensburg, DE
Ulrich Froehler · Nersingen, DE
Ralf Otremba · Kaufbeuren, DE
Andreas Riegler · Tenneck, AT

Key dates

Filing date	Jul 29, 2021
Grant date	May 7, 2024
Priority date	—
Expiry date	Dec 2, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH05K1/185
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device package includes a printed circuit board including a first central area, a second lateral area, and a third lateral area, a semiconductor die including a first main face and a second main face opposite the first main face, a first contact pad on the first main face and a second contact pad on the second main face, the semiconductor die disposed in the first central area of the printed circuit board, a first metallic side wall of the semiconductor device package disposed in the second lateral area of the printed circuit board, a second metallic side wall of the semiconductor device package disposed in the third lateral area of the printed circuit board, wherein at least one of the first metallic side wall and the second metallic side wall is electrically connected with one of the first contact pad or the second contact pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.