Wiring board and method for manufacturing the same
US11979990B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2019 |
| Grant date | May 7, 2024 |
| Priority date | — |
| Expiry date | Dec 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for manufacturing a wiring board according to the present disclosure includes: in the following order, (a) a step of irradiating an insulating layer composed of a resin composition with active energy rays; (b) a step of adsorbing an electroless plating catalyst to the insulating layer; and (c) a step of forming a metal layer on a surface of the insulating layer by electroless plating, in which in the step (a), a modified region having a thickness of 20 nm or more in a depth direction from the surface of the insulating layer and voids communicating from the surface of the insulating layer is formed by irradiation of the active energy rays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.