Patent · US Active

Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edge

US11983135B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Dheeraj Subbareddy · Santa Clara, US
Ankireddy Nalamalpu · Portland, US
Anshuman Thakur · Beaverton, US
MD Altaf Hossain · Portland, US
Mahesh Kumashikar · Kanchinakote, IN
Kemal Aygun · Tempe, US
Casey Glenn Thielen · Chandler, US
Daniel Klowden · Denver, US
Sandeep B. Sane · Chandler, US

Key dates

Filing date	Sep 25, 2020
Grant date	May 14, 2024
Priority date	—
Expiry date	Sep 15, 2042

Classification

Technology area (CPC G)Physics
CPC primaryG06F2213/0026
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Embodiments herein relate to systems, apparatuses, or processes for improving off-package edge bandwidth by overlapping electrical and optical serialization/deserialization (SERDES) interfaces on an edge of the package. In other implementations, off-package bandwidth for a particular edge of a package may use both an optical fanout and an electrical fanout on the same edge of the package. In embodiments, the optical fanout may use a top surface or side edge of a die and the electrical fanout may use the bottom side edge of the die. Other embodiments may be described and/or claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.