Patent · US Active

Vertical inductor for WLCSP

US11984246B2 · kind B2 · utility

0Cited by

2References

13Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Andreas Wolter · Regensburg, DE
Thorsten Meyer · Regensburg, DE
Gerhard Knoblinger · Villach, AT

Key dates

Filing date	Dec 30, 2021
Grant date	May 14, 2024
Priority date	—
Expiry date	Dec 30, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.