Inventor · Regensburg, DE

Thorsten Meyer

226Patents
26h-index
204Co-inventors
93Inventor score

Filing activity: Aug 8, 1995 → Feb 15, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US9646856B2 Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip Electricity 229 Active
US6727576B2 Transfer wafer level packaging Electricity 141 Expired
US9064883B2 Chip with encapsulated sides and exposed surface Electricity 123 Active
US6845554B2 Method for connection of circuit units Emerging Cross-Sectional Technologies 96 Expired
US6936928B2 Semiconductor component and method for its production Electricity 82 Expired
US7834464B2 Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device Electricity 73 Active
US7208345B2 Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device Electricity 67 Expired
US8878360B2 Stacked fan-out semiconductor chip Electricity 58 Active
US8729714B1 Flip-chip wafer level package and methods thereof Electricity 56 Active
US6714418B2 Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another Electricity 55 Expired
US9385105B2 Semiconductor devices Electricity 45 Active
US10211182B2 Package-on-package stacked microelectronic structures Electricity 42 Active
US10043768B2 Semiconductor device and method of manufacture thereof Electricity 42 Active
US8183696B2 Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads Electricity 38 Active
US8258633B2 Semiconductor package and multichip arrangement having a polymer layer and an encapsulant Electricity 37 Active
US9997444B2 Microelectronic package having a passive microelectronic device disposed within a package body Electricity 37 Active
US7759163B2 Semiconductor module Electricity 35 Active
US8451618B2 Integrated antennas in wafer level package Electricity 34 Active
US7906860B2 Semiconductor device Electricity 32 Active
US8829663B2 Stackable semiconductor package with encapsulant and electrically conductive feed-through Electricity 32 Active
US7307328B2 Semiconductor device with temperature sensor Electricity 31 Expired
US8003515B2 Device and manufacturing method Electricity 30 Active
US7247948B2 Semiconductor device and method for fabricating the semiconductor device Electricity 29 Expired
US9663353B2 Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC) Electricity 29 Active
US5868040A Gas pedal with friction structure Emerging Cross-Sectional Technologies 29 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.