Electronic package and manufacturing method thereof
US11984412B2 · kind B2 · utility
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10Claims
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Assignee
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Key dates
| Filing date | Jan 17, 2023 |
| Grant date | May 14, 2024 |
| Priority date | — |
| Expiry date | Jan 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.