Liquid-cooling heat dissipation plate with pin-fins and enclosed liquid cooler having the same
US11988467B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2022 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Aug 18, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2215/04
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A liquid-cooling heat dissipation plate with pin-fins and an enclosed liquid cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of rhombus-shaped pin-fins, and a plurality of ellipse-shaped pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface opposite to each other. The first heat dissipation surface is in contact with a heat source, and the second heat dissipation surface is in contact with a cooling fluid. The rhombus-shaped pin-fins and the ellipse-shaped pin-fins are integrally formed on the second heat dissipation surface and in a high density arrangement. The ellipse-shaped pin-fins correspond in position to a relative low temperature region of the heat source, and the rhombus-shaped pin-fins correspond in position to a relative high temperature region of the heat source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.