Method and apparatus for adjusting metal wiring density
US11989499B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2022 |
| Grant date | May 21, 2024 |
| Priority date | — |
| Expiry date | Dec 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5286
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present application provide a method and an apparatus for adjusting metal wiring density. By detecting metal wiring density in each of metal density detection windows in a target layout, a region in which the metal wiring density is greater than a preset density threshold can be quickly positioned in the target layout, thereby improving the layout correction efficiency; then a power fill mesh in a target metal density detection window in which the metal wiring density is greater than the preset density threshold is cropped multiple times, until the metal wiring density in each of the metal density detection windows is less than or equal to the preset density threshold, such that sufficient power fill meshes are retained in the target layout while the metal wiring density of the target layout is less than or equal to the preset density threshold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.